z ibo seno electronic engineering co., ltd. www.senocn.com mil-std- 202, method 208 weight: 1.7 grams (approx.) polarity: as marked on body ideal for printed circuit boards high surge current capability low forward voltage drop case: molded plastic kbp3005 ? kbp310 3.0a bri dge rectifier features ! diffus ed junction ! ! high current capability ! high reliability ! ! mechanic al d ata ! ! t er minals: plated leads solderable per ! ! ! mounting position: any ! marking: type number maximum r a tings and electrical characteristics @t a =25 c unless otherwise specified single phase, half wave, 60hz, resistive or inductive load. for capacitive load, derate current by 20%. note: 1. leads maintained at ambient temperature at a distance of 9.5mm from the case. 2. measured at 1.0 mhz and applied reverse voltage of 4.0v d.c. 3. thermal resistance junction to ambient mounted on pc board with 12mm 2 copper pad. 1 of 2 kbp3005 ? kbp310 ! lea d free: for rohs / lead free version characteris ti c symbol kbp 3005 kbp 301 kbp 302 kbp 304 kbp 306 kbp 308 kbp 310 unit p eak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 50 100 200 400 600 800 1000 v rm s reverse voltage v r(rm s) 35 70 140 280 420 560 700 v a v erage rectified output current (note 1) @t a = 50 c i o 3.0 a non-repet i tive peak forward surge current 8.3ms single half sine-wave superimposed on rated load (jedec method) i fsm 60 a forward v ol tage (per element) @i f = 2. 0a v fm 1.1 v pe a k reverse current @t a = 25 c at rated dc blocking voltage @t a = 100 c i rm 5 500 a t y pical thermal resistance (note 3) r ja 30 k / w operat i ng and storage temperature range t j, t stg -55 t o +150 c b ~ ~ + c g kbp di m min max a 14. 22 15. 24 b 10.60 1 1.68 c 15. 20 ? d 3.40 4. 20 e 3. 60 4. 10 g 0. 70 0.9 i 1. 52 ? j 1 1. 68 12.70 k 12. 7 ? l 3. 2 x 45 typical a l l dimensions in mm a l j k i h d 1.27 ? h - e
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